Surface treatment equipment|Micro etching equipment | Official site of Ninomiya System Co., Ltd. in Nishinari-ku, OsakaSurface treatment equipment|Micro etching equipment | Official site of Ninomiya System Co., Ltd. in Nishinari-ku, Osaka

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Surface treatment equipment|Micro etching equipment

Surface treatment equipment|Micro etching equipment

It is stable and can transport work of board thickness 50μm

The realization of uniform surface treatment by high surface accuracy
Available for FPC transport

Use

Roughening treatment of copper surface

Specifications example

Equipment dimension (L×W×H)    :    13625 × 4050 × 1350 mm
Board size (effective width)    :    500mm
Process liquid    :    various chemicals maker correspondence
Transportation rate    :    1~4m/min
Pass line    :    
Operation system    :   

Line configuration example

Surface treatment equipment|Micro etching equipment Line configuration example


*Equipment materials vary according to chemicals
*Please feel free to contact us for other special specifications

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